Ball grid array housing having a cooling foil

Details Ball grid array housing having a cooling foil Ball grid array housing having a cooling foil

2007-08-14

2007-08-14

Andujar, Leonardo (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257SE23103, C257S707000, C257SE23130, C438S122000

Reexamination Certificate

active

11143123

ABSTRACT:
A ball grid array housing, a semiconductor device having a ball grid array housing and an electronic circuit are disclosed. In one embodiment, a ball grid array housing includes a substrate with solder ball connections pointing out from a housing and at least one semiconductor chip. For better heat dissipation from the housing, the ball grid includes a metallic cooling foil, or a metallic cooling plate. A method of making a ball grid array is also disclosed.

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Lee, Tien-Tu (Tom), “An Investigation of Thermal Enhancement on Flip Chip Plastic BGA Packages Using CFD Tool,” IEEE Transactions on Components and Packaging Technologies, vol. 23, No. 3, Sep. 2000, pp. 481-489.

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