Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2007-08-07
2007-08-07
Whitehead, Jr., Carl (Department: 2813)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S737000, C257S738000, C257S777000, C257S778000, C257S780000, C438S108000, C438S109000, C438S612000, C361S720000, C361S735000, C361S736000, C361S748000, C361S760000, C361S761000
Reexamination Certificate
active
10346277
ABSTRACT:
The present invention provides for a BGA solder ball interconnection to an outer conductive layer of a laminated circuit assembly having an underlying circuit layer. The invention includes a raised BGA solder ball pad substantially co-planar with the outer conductive layer, the raised pad having a raised face and a plurality of vertical conductive walls and a BGA solder ball having an average diameter of greater than the width of the raised face, the BGA solder ball being adhered to the raised face and to a substantial portion of the vertical conductive walls.
REFERENCES:
patent: 4642889 (1987-02-01), Grabbe
patent: 5097393 (1992-03-01), Nelson et al.
patent: 5108553 (1992-04-01), Foster et al.
patent: 5214308 (1993-05-01), Nishiguchi et al.
patent: 5252857 (1993-10-01), Kane et al.
patent: 5266746 (1993-11-01), Nishihara et al.
patent: 5357403 (1994-10-01), Haller et al.
patent: 5474458 (1995-12-01), Vafi et al.
patent: 5476818 (1995-12-01), Yanof et al.
patent: 5578796 (1996-11-01), Bhatt et al.
patent: 5639696 (1997-06-01), Liang et al.
patent: 5642261 (1997-06-01), Bond et al.
patent: 5689091 (1997-11-01), Hamzehdoost et al.
patent: 5726501 (1998-03-01), Matsubara
patent: 5736679 (1998-04-01), Kresge et al.
patent: 5751060 (1998-05-01), Laine et al.
patent: 5758413 (1998-06-01), Chong et al.
patent: 5814393 (1998-09-01), Miyaake et al.
patent: 5814847 (1998-09-01), Shihadeh et al.
patent: 5829124 (1998-11-01), Kresge et al.
patent: 5854507 (1998-12-01), Miremadi et al.
patent: 5861666 (1999-01-01), Bellaar
patent: 5891753 (1999-04-01), Akram
patent: 5939783 (1999-08-01), Laine et al.
patent: 5990546 (1999-11-01), Igarashi et al.
patent: 6016013 (2000-01-01), Baba
patent: 6020561 (2000-02-01), Ishida et al.
patent: 6034332 (2000-03-01), Moresco et al.
patent: 6050832 (2000-04-01), Lee et al.
patent: 6084300 (2000-07-01), Oka
patent: 6102710 (2000-08-01), Beilin et al.
patent: 6104082 (2000-08-01), Berlin et al.
patent: 6104084 (2000-08-01), Ishio et al.
patent: 6121676 (2000-09-01), Solberg
patent: 6121682 (2000-09-01), Kim
patent: 6137164 (2000-10-01), Yew et al.
patent: 6140707 (2000-10-01), Plepys et al.
patent: 6153508 (2000-11-01), Harvey
patent: 6175158 (2001-01-01), Degani et al.
patent: 6175161 (2001-01-01), Goetz et al.
patent: 6194250 (2001-02-01), Melton et al.
patent: 6217987 (2001-04-01), Ono et al.
patent: 6222246 (2001-04-01), Mak et al.
patent: 6222265 (2001-04-01), Akram et al.
patent: 6228466 (2001-05-01), Tsukada et al.
patent: 6229209 (2001-05-01), Nakamura et al.
patent: 6239496 (2001-05-01), Asada
patent: 6291267 (2001-09-01), Dore et al.
patent: 6297551 (2001-10-01), Dudderar et al.
patent: 6300161 (2001-10-01), Goetz et al.
patent: 6303997 (2001-10-01), Lee
patent: 6310403 (2001-10-01), Zhang et al.
patent: 6331939 (2001-12-01), Corisis et al.
patent: 6333563 (2001-12-01), Jackson et al.
patent: 6335571 (2002-01-01), Capote et al.
patent: 6388333 (2002-05-01), Taniguchi et al.
patent: 6396707 (2002-05-01), Huang et al.
patent: 6443351 (2002-09-01), Huang et al.
patent: 6492255 (2002-12-01), Enomoto et al.
patent: 6492600 (2002-12-01), Jimarez et al.
patent: 6559390 (2003-05-01), Tanaka
patent: 6580169 (2003-06-01), Sakuyama et al.
patent: 6756684 (2004-06-01), Huang
patent: 6756685 (2004-06-01), Tao
patent: 6803663 (2004-10-01), Hashimoto
patent: 6828669 (2004-12-01), Iijima et al.
patent: 6984544 (2006-01-01), Cloud et al.
patent: 7019407 (2006-03-01), Chen et al.
patent: 2002/0014346 (2002-02-01), Tsunemasu et al.
patent: 2002/0053466 (2002-05-01), Kasui
patent: 2002/0068381 (2002-06-01), Ference et al.
patent: 2003/0006494 (2003-01-01), Lee et al.
patent: 2003/0047348 (2003-03-01), Jessep et al.
patent: 2003/0164551 (2003-09-01), Lee et al.
patent: 2003/0215249 (2003-11-01), Shinkawa et al.
patent: 2003/0234118 (2003-12-01), Hsu et al.
patent: 2004/0129453 (2004-07-01), Boggs et al.
patent: 6-204288 (1994-07-01), None
patent: 2001-156121 (2001-06-01), None
patent: 2001156121 (2001-06-01), None
Farber, A. S.; “High-Capacitance Power Distribution Network”;IBM Technical Disclosure Bulletin; Mar. 1967; vol. 9, No. 10; p. 1266.
Cavaliere, J. R. et al.; “High-Performance Single-Chip Module”;IBM Technical Disclosure Bulletin; Jun. 1981; vol. 24, No. 1A; pp. 46-48.
Carr LLP
Jr. Carl Whitehead
Mitchell J. D.
Rifai D'Ann N.
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