Ball assignment schemes for integrated circuit packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

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Details

C257S693000, C257S697000, C257S773000, C257S778000

Reexamination Certificate

active

07095107

ABSTRACT:
The present disclosure is directed to ball assignment schemes for ball grid array packages in integrated circuits with increased signal count. The ball assignment scheme includes an array of electrical contacts. The array has a first diagonal including a pair of signal contacts adjacent to a pair of first-type voltage supply contacts. The array further includes a crossing diagonal having a pair of adjacent second-type voltage supply contacts, which crosses the first diagonal between the pair of signal contacts such that the pair of second-type voltage supply contacts oppose one another relative to the first diagonal.

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patent: 2005/0050505 (2005-03-01), Bednar et al.

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