Ball grid array integrated circuit package which employs a flip

Details Ball grid array integrated circuit package which employs a flip Ball grid array integrated circuit package which employs a flip

1997-08-21

1998-08-25

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

257778, 257780, H01L 2334

Patent

active

057985677

ABSTRACT:
A ball grid array to integrated circuit interconnection. The interconnection includes a ball grid array substrate having a first surface and a second surface. The first surface comprising a plurality of substrate interconnection conductive pads. A power supply via connects a power supply conductive pad of the first surface to a first conductive area on the second surface. A ground via connects a ground conductive pad of the first surface to a second conductive area on the second surface. A decoupling capacitor connected between the first conductive area and the second conductive area. The interconnection further comprises an integrated circuit comprising a plurality of integrated circuit conductive pads. A plurality of smaller solder balls interconnect at least one of the integrated circuit conductive pads to at least one of the substrate interconnection conductive pads. A circuit board substrate is electrically interconnected by larger solder balls to the ball grid array substrate.

REFERENCES:
patent: 4672421 (1987-06-01), Lin
patent: 5473512 (1995-12-01), Degani et al.
patent: 5477082 (1995-12-01), Buckley et al.
patent: 5608262 (1997-03-01), Degani et al.
patent: 5635767 (1997-06-01), Wenzel et al.

Affiliated with

Also associated with

Rating

Ball grid array integrated circuit package which employs a flip does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Ball grid array integrated circuit package which employs a flip , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ball grid array integrated circuit package which employs a flip will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-37775