Ball grid array copper balancing

Details Ball grid array copper balancing Ball grid array copper balancing

2007-04-17

2007-04-17

Soward, Ida M. (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S684000, C257S690000, C257S692000, C257S737000, C257S738000, C257S758000, C257S759000, C257S760000, C257S773000, C257S774000, C257S775000, C257S780000, C257S781000

Reexamination Certificate

active

10610317

ABSTRACT:
A ball grid array device includes a substrate having a first major surface and a second major surface. The first major surface includes leads for electrical connections. The second major surface is devoid of leads. The ball grid array device also includes a first land having a solder mask opening at the first major surface of the substrate, and a second, buried land near the first major surface of the substrate. A method for forming an electronic device includes forming an electronic circuit in a substrate, placing an input pad for an input to the electronic circuit on at least one major surface of the substrate, placing an output pad for an output from the electronic circuit on the at least one major surface of the substrate, and placing an electrically isolated pad near the at least one major surface of the substrate.

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