LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Apparatus and method for thermal and electromagnetic...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Apparatus and method for use in mounting electronic elements

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Apparatus and methods for cooling semiconductor integrated...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Apparatus and process for improved die adhesion to organic chip

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Apparatus carrying electronic device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Apparatus for a vertically accumulable semiconductor device...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Apparatus for achieving mechanical and thermal isolation of port

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Apparatus for an air impingement heat sink using secondary flow

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With housing mount

Apparatus for and method of packaging semiconductor devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Apparatus for attaching a heat sink to the back side of a flip c

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Apparatus for conditioning power and managing thermal energy...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Apparatus for connecting an IC terminal to a reference...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Apparatus for controlling thermal interface gap distance

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Apparatus for cooling a semiconductor die

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Apparatus for cooling charge coupled device imaging systems

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Apparatus for cooling integrated circuit chips

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Apparatus for cooling semiconductor chips in multichip modules

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Apparatus for effecting reliable heat transfer of bare die...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Apparatus for effecting reliable heat transfer of bare die...