Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2006-06-06
2006-06-06
Clark, Jasmine (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S780000, C257S781000, C257S784000, C257S775000, C438S051000, C438S064000, C438S127000
Reexamination Certificate
active
07057271
ABSTRACT:
A circuit chip has an apparatus for an electrically conductive connection of a terminal thereof to an external reference potential. The apparatus has a parallel connection of a bonding wire and a semiconductor area formed in a substrate of the circuit chip. The semiconductor area is doped higher than the substrate of the circuit chip.
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Forstner Johann-Peter
Weber Stephan
Clark Jasmine
Infineon - Technologies AG
Maginot Moore & Beck
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