Apparatus for effecting reliable heat transfer of bare die...

Details Apparatus for effecting reliable heat transfer of bare die... Apparatus for effecting reliable heat transfer of bare die...

2007-06-22

2009-06-23

Potter, Roy K (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257S718000, C438S122000

Reexamination Certificate

active

07550840

ABSTRACT:
Apparatus and method include using a bare die microelectronic device; a heat sink assembly; a heat sink mounting assembly for mounting the heat sink assembly independently of the bare die microelectronic device; and, a force applying mechanism that compression loads, under controlled forces, a surface of the bare die into a direct heat transfer relationship at a thermal interface with a heat sink assembly.

REFERENCES:
patent: 5533256 (1996-07-01), Call et al.
patent: 5883782 (1999-03-01), Thurston et al.
patent: 5990552 (1999-11-01), Xie et al.
patent: 2582169 (2003-10-01), None
patent: 2004/097937 (2004-11-01), None

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