Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2006-04-26
2009-12-22
Hoang, Quoc D (Department: 2892)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S696000, C257SE23043, C257SE23060
Reexamination Certificate
active
07635915
ABSTRACT:
Some embodiments provide surface mount devices that include a first electrode comprising a chip carrier part, a second electrode disposed proximate to the chip carrier part, and a casing encasing a portion of the first and second electrodes. The first electrode can extend from the chip carrier part toward a perimeter of the casing, and the second electrode can extend away from the chip carrier part and projects outside of the casing. In extending away from the chip carrier part the first electrode divides into a plurality of leads separated by an aperture that join into a single first joined lead portion with a first width before projecting outside of the casing and maintains the first width outside of the casing. The second electrode can attain a second width prior to projecting outside of the casing and maintains the second width outside the casing.
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Cheng Siu Cheong
Xie Jian Hui
Cree Hong Kong Limited
Hoang Quoc D
Koppel, Patrick, Heybl & Dawson
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