Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2011-03-08
2011-03-08
Monbleau, Davienne (Department: 2893)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S777000, C257S693000, C257SE25006, C257SE21614, C257SE23085
Reexamination Certificate
active
07902651
ABSTRACT:
A multi-chip stack module provides increased circuit density for a given surface chip footprint. The multi-chip stack module comprises support structures alternating with standard surface mount type chips to form a stack wherein the support structures electrically interconnect the chips. Various embodiments disclose a structure and method for interconnecting a plurality of generally planar chips in a vertical stack such that common signals are connected in the stack and individually-accessed signals are separated within the stack.
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McDermott Will & Emery LLP
Monbleau Davienne
Nguyen Dilinh P
Stec Inc.
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