Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1997-02-07
1999-11-23
Kelley, Nathan K.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257712, H01L 2334
Patent
active
059905522
ABSTRACT:
An apparatus for removing heat from the backside of a packaged flip chip. In one embodiment, the top side of an integrated circuit die is mechanically and electrically coupled to the top surface of a package substrate via a plurality of solder bump interconnections. A heatsink is supported above the backside surface of the die and the package substrate by standoffs. The height of the standoffs is selected to produce a gap between the heatsink and the backside of the die. The gap is filled with a highly conductive heat transfer medium, such as a thermal grease, to provide a heat path between the die and the heatsink. A spring clip flexibly attaches the heatsink to the package by providing a force to the heatsink to seat the standoffs against the top surface of the package substrate.
REFERENCES:
patent: 5280409 (1994-01-01), Selna et al.
patent: 5396402 (1995-03-01), Perugini et al.
patent: 5570271 (1996-10-01), Lavochkin
ICMCM Proceedings '92, "Backside Cooling of Flip Chip Devices in Multichip Modules", pp. 828-839, 1992.
Brownell Michael
Xie Hong
Intel Corporation
Kelley Nathan K.
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