Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1997-05-14
1999-07-13
Arroyo, Teresa M.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257707, 257714, H01L 2334, H01L 2310
Patent
active
059230860
ABSTRACT:
A method and an apparatus for cooling a semiconductor die. In one embodiment, a C4 packaged semiconductor die is thermally coupled to a cooling plate having an opening. The opening of the cooling plate is disposed over a back side surface of the semiconductor die such that direct unobstructed access to the exposed back side surface of the semiconductor die is provided. A conformable thermal conductor, such as indium, is disposed between the semiconductor die and the cooling plate to improve the thermal coupling between the semiconductor and cooling plate. In one embodiment, the semiconductor die is mounted on a circuit board and a cooling block is disposed on the opposite side of the circuit board. The cooling plate is thermally coupled to the cooling block with heat transfer conduits, such as thermal screws, that extend through the circuit board to transfer the heat from the semiconductor die through the cooling plate through the heat transfer conduits to the cooling block located on the opposite side of the circuit board. In one embodiment, coolant is circulated through the cooling block to remove heat from the cooling block.
REFERENCES:
patent: 3654528 (1972-04-01), Barkan
patent: 3990100 (1976-11-01), Mamine et al.
patent: 4168113 (1979-09-01), Chang et al.
patent: 4529685 (1985-07-01), Borodovsky
patent: 4582954 (1986-04-01), Eaton et al.
patent: 4617252 (1986-10-01), Cordes, III et al.
patent: 4649992 (1987-03-01), Geen et al.
patent: 4672422 (1987-06-01), Schierz
patent: 5000256 (1991-03-01), Tousignant
patent: 5001548 (1991-03-01), Iversen
patent: 5004307 (1991-04-01), Kino et al.
patent: 5061568 (1991-10-01), Kessel et al.
patent: 5070040 (1991-12-01), Pankove
patent: 5106786 (1992-04-01), Brady et al.
patent: 5146314 (1992-09-01), Pankove
patent: 5243458 (1993-09-01), Hatano et al.
patent: 5285351 (1994-02-01), Ikeda
patent: 5354717 (1994-10-01), Pollock et al.
patent: 5376587 (1994-12-01), Buchmann et al.
patent: 5418019 (1995-05-01), Chen et al.
patent: 5463528 (1995-10-01), Umezawa
patent: 5500540 (1996-03-01), Jewell et al.
patent: 5508230 (1996-04-01), Anderson et al.
D.L. Barton, "Infrared Light Emission from Semiconductor Devices", Proc. of the 22nd Internat. Symp. for Testing and Failure Analysis, pp. 9-17, Nov. 18-22, Los Angeles, CA, Nov. 1996.
S. Hayashi, "Solid Immersion Lens for Optical Storage", SPIE Symp. on Electronic Imaging Science & Technology, Report No. 5285, Feb. 5-10, 1995.
D. Voorhes, "Liquid Cooling for DPSS Lasers", Lasers & Optronics, Aug., 1996.
Ma Karl J.
Paniccia Mario J.
Winer Paul
Arroyo Teresa M.
Intel Corporation
LandOfFree
Apparatus for cooling a semiconductor die does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Apparatus for cooling a semiconductor die, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for cooling a semiconductor die will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2278202