Apparatus carrying electronic device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

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Details

C257S100000, C257S775000, C257S798000, C333S032000, C333S033000

Reexamination Certificate

active

06917101

ABSTRACT:
An apparatus in which a device electrode pad in an electronic device and a connecting conductor pattern in a substrate are connected to each other through a plurality of wire thin lines which differ from one another in mechanical characteristic frequencies. Even if the frequency of vibration applied to the apparatus from the exterior coincides with the characteristic frequency of the given wire thin line so that the wire thin line is broken, it does not coincide with the characteristic frequency of the other wire thin line. Accordingly, no resonance phenomenon occurs in the other wire thin line, thereby reducing a probability that the wire thin line is broken.

REFERENCES:
patent: 4686492 (1987-08-01), Grellmann et al.
patent: 4891686 (1990-01-01), Krausse, III
patent: 6373447 (2002-04-01), Rostoker et al.
patent: 2002/0113525 (2002-08-01), Nakao et al.
patent: 07-193450 (1995-07-01), None
patent: 08-193902 (1996-07-01), None
patent: 10-150137 (1998-06-01), None
patent: 2000-013165 (2000-01-01), None
patent: 2000-286662 (2000-10-01), None

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