Apparatus for cooling charge coupled device imaging systems

Details Apparatus for cooling charge coupled device imaging systems Apparatus for cooling charge coupled device imaging systems

1995-07-28

1997-01-21

Whitehead, Jr., Carl

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257712, 257715, 257716, 361689, 361698, 361699, 361702, H01L 2334, H05K 720

Patent

active

055962289

ABSTRACT:
Apparatus for cooling charge-coupled device (CCD) imaging systems. The apparatus comprises a thermoelectric cooler thermally coupled to the imaging system for transferring heat away from and cooling the imaging system portion of the imaging system. The thermoelectric cooler has a cold side and an opposing hot side, with the cold side thermally coupled to the imaging sensor to enable the transfer of heat from the sensor in response to a supply of power. A power supply is coupled to the cooler for supplying required power. The hot side of the cooler is thermally coupled to a heat pipe, which is composed of a heat-conducting material having a hollow portion containing a wicking material and a working fluid. A heat sink is thermally coupled to the heat pipe enabling heat dissipation. The working fluid cyclically evaporates into vapor and condenses into liquid to effect the heat transfer from the heat pipe to the heat sink.

REFERENCES:
patent: 4253515 (1981-03-01), Swiatosz
patent: 5216580 (1993-06-01), Davidson et al.

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