Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
2007-10-30
2007-10-30
Lebentritt, Michael (Department: 2813)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C257S675000, C257S706000, C257S717000, C438S106000, C438S122000
Reexamination Certificate
active
10789500
ABSTRACT:
Apparatus and methods are provided for thermally coupling a semiconductor chip directly to a heat conducting device (e.g., a copper heat sink) using a thermal joint that provides increased thermal conductivity between the heat conducting device and high power density regions of the semiconductor chip, while minimizing or eliminating mechanical stress due to the relative displacement due to the difference in thermal expansion between the semiconductor chip and the heat conducting device.
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Colgan Evan George
Gelorme Jeffrey D.
Sikka Kamal K.
Toy Hilton T.
Zitz Jeffrey Allen
DeRosa Frank V.
F. Chau & Associates LLC
Lebentritt Michael
Mitchell James M
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