LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package,With contact or lead

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Terminal configuration in semiconductor IC device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Termination ring for integrated circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Test carrier for semiconductor components having conductors...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Testable low inductance integrated circuit package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Thermally enhanced integrated circuit packaging system

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Thermally enhanced tape ball grid array package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Thick film hybrid multilayer circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Thick metal top layer

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Thin cavity down ball grid array package based on wirebond techn

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Thin chip-size integrated circuit package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Thin film capacitors and methods of making the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Thin film flexible interconnect for infrared detectors

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Thin film metallization process for improved metal to substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Thin high-frequency module having integrated circuit chip...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Thin semiconductor package having stackable lead frame and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Thin soldered semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Thin type semiconductor device, module structure using the devic

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Thin type semiconductor device, module structure using the devic

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Three-dimensional multimodule HDI arrays with heat spreading