Thick film hybrid multilayer circuit

Details Thick film hybrid multilayer circuit Thick film hybrid multilayer circuit

1994-02-14

1995-12-12

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257701, 257717, 257724, 257778, 257713, H01L 2312

Patent

active

054752639

ABSTRACT:
A thick film hybrid multilayer circuit is provided in which circuit devices are electrically interconnected with a multilayer structure composed of multiple layers of conductors interlaid with layers of a dielectric material in order to achieve high component density. The circuit devices of the hybrid circuit are directly mounted to a substrate, with the multilayer conductor-dielectric structure being located on an opposite surface of the substrate so as to insulate the multilayer conductor-dielectric structure from the circuit devices. As such, the multilayer conductor-dielectric structure, which is inherently weaker than the substrate, is relatively insulated from the adverse effects caused by thermal cycling during the operation of the hybrid circuit, so as to reduce the likelihood of cracks developing in the dielectric material within the multilayer conductor-dielectric structure.

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patent: 5169805 (1992-12-01), Mok et al.
patent: 5179039 (1993-01-01), Ishida et al.
patent: 5182632 (1993-01-01), Bechtel et al.

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