Terminal arrangement for an SMD-capable hybrid circuit

Details Terminal arrangement for an SMD-capable hybrid circuit Terminal arrangement for an SMD-capable hybrid circuit

1998-04-23

2000-06-06

Picard, Leo P.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257696, 257732, 257733, 361784, 361785, H01L 2302, H01L 23495

Patent

active

060722355

ABSTRACT:
Terminal pins with two lateral portions and a bridge-shaped elevated middle portion are provided. The terminal pin and perpendicularly rising hybrid circuit typically together have an inverted T shape. On the one hand, the hybrid circuit stands on its own on the substrate without further means of assistance and can be soldered. On the other hand, the bridge-shaped construction effects a sufficient elasticity and carrying capacity relative to swivellings, or respectively, accelerations, as well as effecting the presence of two defined support surfaces whose co-planarity is guaranteed by the springing configuration of the terminal pins.

REFERENCES:
patent: 5142263 (1992-08-01), Childers
patent: 5661339 (1997-08-01), Clayton
patent: 5751553 (1998-05-01), Clayton
Patent Abstracts of Japan: No. 63-16650, Jan. 23, 1988.
Patent Abstracts of Japan: No. 4-243155, Aug. 31, 1992.
Patent Abstracts of Japan: No. 5-308114, Nov. 19, 1993.

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