LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package,With contact or lead

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Capacitance type semiconductor sensor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Capacitance type semiconductor sensor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Capacitor embedded in interposer, semiconductor device...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Capacitor-built-in type printed wiring substrate, printed...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Capacitor-built-in type printed wiring substrate, printed...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Carrier, method of manufacturing a carrier and an electronic...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Castellation wafer level packaging of integrated circuit chips

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Cavity ball grid array apparatus

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Cavity down plastic ball grid array multi-chip module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Cavity semiconductor package with exposed leads and die pad

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ceramic chip-type electronic component and method of making...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ceramic electronic package design

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ceramic embedded wireless antenna

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ceramic microelectronics package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ceramic multilayer substrate and method for manufacturing...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ceramic package and chip resistor, and methods for...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ceramic-glass IC package assembly having multiple conductive lay

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ceramic-metal composite structure and process of producing same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Chip array with two-sided cooling