LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package,With contact or lead

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

I/O pin having solder dam for connecting substrates

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

IC chip, antenna, and manufacturing method of the IC chip...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

IC die power connection using canted coil spring

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

IC package and LSI package using a lead frame formed of a copper

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

IC package having a single wiring sheet with a lead pattern disp

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

IC package structure for achieving better heat dissipation

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

IC package with electric conductor lines in dielectric package b

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

IC packages including separated signal and power supply edge con

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

IGBT and free-wheeling diode combination

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Image forming apparatus with improved transfer efficiency

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

In-process semiconductor packages with leadframe grid arrays

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Inner-digitized bond fingers on bus bars of semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Insulated cube with exposed wire lead

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Insulators for high density circuits

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Integral capacitor using embedded enclosure for effective...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Integrated chip package with reduced dimensions and leads expose

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Integrated circuit (IC) package with a microcontroller...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Integrated circuit and supply decoupling capacitor therefor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Integrated circuit anti-bridging leads design