Thin film capacitors and methods of making the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S703000, C257SE23009, C257SE23057

Reexamination Certificate

active

07453144

ABSTRACT:
An apparatus including a first electrode; a second electrode; a first and second ceramic material disposed between the first electrode and the second electrode, the second ceramic material having a greater electrical conductivity than the first ceramic material. A method including forming a first ceramic material film and a different second ceramic material film on a first electrode; and forming a second electrode on the second ceramic material film to form a capacitor structure having the first ceramic material film and the second ceramic material film disposed between the first electrode and the second electrode, wherein the first ceramic material has a conductivity selected to dampen undesired oscillations in electrical device operation to which the capacitor structure may be exposed. An apparatus including a first electrode; a second electrode; and a composite dielectric including a plurality of dielectric films including a different Curie temperature.

REFERENCES:
patent: 4241378 (1980-12-01), Dorrian
patent: 4458295 (1984-07-01), Durschlag et al.
patent: 4528613 (1985-07-01), Stetson et al.
patent: 4687540 (1987-08-01), Singhdeo et al.
patent: 4702967 (1987-10-01), Black et al.
patent: 5065275 (1991-11-01), Fujisaki et al.
patent: 5155655 (1992-10-01), Howard et al.
patent: 5160762 (1992-11-01), Brand et al.
patent: 5172304 (1992-12-01), Ozawa et al.
patent: 5177670 (1993-01-01), Shinohara et al.
patent: 5191510 (1993-03-01), Huffman
patent: 5206788 (1993-04-01), Larson et al.
patent: 5504993 (1996-04-01), Szerlip et al.
patent: 5745334 (1998-04-01), Hoffarth et al.
patent: 5796572 (1998-08-01), Kawai
patent: 5800575 (1998-09-01), Lucas
patent: 5889647 (1999-03-01), Hansen et al.
patent: 5912044 (1999-06-01), Farooq et al.
patent: 5952040 (1999-09-01), Yadav et al.
patent: 5978207 (1999-11-01), Anderson et al.
patent: 6043973 (2000-03-01), Nagashima et al.
patent: 6058004 (2000-05-01), Duva et al.
patent: 6178082 (2001-01-01), Farooq et al.
patent: 6216324 (2001-04-01), Farooq et al.
patent: 6226172 (2001-05-01), Sato et al.
patent: 6351368 (2002-02-01), Kim
patent: 6372286 (2002-04-01), Azuma et al.
patent: 6433993 (2002-08-01), Hunt et al.
patent: 6437970 (2002-08-01), Lee et al.
patent: 6477034 (2002-11-01), Chakravorty et al.
patent: 6524352 (2003-02-01), Adae-Amoakoh et al.
patent: 6541137 (2003-04-01), Kingon et al.
patent: 6617681 (2003-09-01), Bohr
patent: 6623865 (2003-09-01), Zou et al.
patent: 6631551 (2003-10-01), Bowles et al.
patent: 6638378 (2003-10-01), O'Bryan et al.
patent: 6672912 (2004-01-01), Figueroa
patent: 6775150 (2004-08-01), Chakravorty et al.
patent: 6795296 (2004-09-01), Palanduz et al.
patent: 6891258 (2005-05-01), Alexander et al.
patent: 6907658 (2005-06-01), Li
patent: 6937035 (2005-08-01), Kawaike et al.
patent: 6980416 (2005-12-01), Sakaguchi et al.
patent: 7038235 (2006-05-01), Seitz
patent: 7072167 (2006-07-01), Borland
patent: 2001/0019144 (2001-09-01), Roy
patent: 2001/0054748 (2001-12-01), Wikborg et al.
patent: 2002/0080551 (2002-06-01), Kitagawa et al.
patent: 2002/0175402 (2002-11-01), McCormack et al.
patent: 2003/0016026 (2003-01-01), Kawaike et al.
patent: 2003/0136997 (2003-07-01), Shioga et al.
patent: 2003/0170432 (2003-09-01), Kobayashi et al.
patent: 2003/0184953 (2003-10-01), Lee et al.
patent: 2003/0207150 (2003-11-01), Maria et al.
patent: 2003/0230768 (2003-12-01), Seitz
patent: 2004/0027813 (2004-02-01), Li
patent: 2004/0081811 (2004-04-01), Casper et al.
patent: 2004/0089471 (2004-05-01), Andoh et al.
patent: 2004/0126484 (2004-07-01), Croswell et al.
patent: 2004/0175585 (2004-09-01), Zou et al.
patent: 2004/0257749 (2004-12-01), Otsuka et al.
patent: 2005/0011857 (2005-01-01), Borland et al.
patent: 2005/0118482 (2005-06-01), Sriramulu et al.
patent: 2005/0151156 (2005-07-01), Wu et al.
patent: 2005/0213020 (2005-09-01), Takeda et al.
patent: 2006/0099803 (2006-05-01), Yongki
patent: 2006/0143886 (2006-07-01), Srinivasan et al.
patent: 0977218 (2000-02-01), None
patent: 02-005507 (1990-01-01), None
patent: 03/178112 (1991-08-01), None
patent: 07122456 (1995-12-01), None
patent: 2002-297939 (2001-10-01), None
patent: 2002-305125 (2002-10-01), None
Offerman, SE, et al: “Grain Nucleation and Growth During Phase Transformations,” Science (2002) 298-1003-1005.
Felten, J, et al.: “Embedded Ceramic Resistors and Capacitors in PWB: Process and Performance”; http://edc.ncms.org/ (2004) 7 pages.
Ohly, C. et al., “Defects in alkaline earth titanate thin films—the conduction behavior of doped BST,” Integrated Ferroelectronics, 2001, vol. 38, pp. 229-237.
Ohly, C. et al., “High termperature conductivity behavior of doped SrTiO3 thin films,” Integrated Ferroelectronics, 2001, vol. 33, pp. 363-372.
Ohly, C. et al., “Electrical conductivity and segregation effects of doped SrTiO3 thin films,” Journal of European Ceramic Society, 21 (2001) 1673-1676.
PCT Search Report and Written Opinion for PCT Appln. No. PCT/US2005/037626, mailed May 8, 2006 (9 pages).
Office Action for U.S. Appl. No. 10/974,139, mailed Dec. 13, 2006 (11 pages).
Office Action for U.S. Appl. No. 10/971,829, mailed Jan. 3, 2007 (8 pages).
Office Action for U.S. Appl. No. 10/976,425, mailed Mar. 26, 2007 (7 pgs).
Office Action for U.S. Appl. No. 10/974,139, mailed Apr. 17, 2007 (13 pgs).
Office Action for U.S. Appl. No. 11/096,313, mailed May 31, 2007 (16 pgs).
Imanaka, Yoshihiko et al., “Decoupling Capacitor with Low Inductance for High-Frequency Digital Applications,” FUJITSU Sci. Tech. J., 38, 1, Jun. 2002, pp. 22-30.
Nagata, Hirotoshi et al., “Improvement of Bonding Strength Between Au/Ti and SiO2Films by Si Layer Insertion,” J. Vac. Sci. Technol. A 17(3), May/Jun. 1999, pp. 1018-1023.
Office Action for U.S. Appl. No. 10/882,745, mailed Mar. 17, 2005 (12 pgs).
Office Action for U.S. Appl. No. 10/882,745, mailed Oct. 4, 2005 (10 pgs).
Office Action for U.S. Appl. No. 10/882,745, mailed Apr. 3, 2006 (9 pgs).
Office Action for U.S. Appl. No. 10/882,745, mailed Aug. 30, 2006 (12 pgs).
Office Action for U.S. Appl. No. 10/882,745, mailed Jan. 10, 2007 (13 pgs).
Office Action for U.S. Appl. No. 10/882,745, mailed May 1, 2007 (12 pgs).
Office Action for U.S. Appl. No. 10/971,829, mailed Mar. 8, 2006 (8 pgs).
Office Action for U.S. Appl. No. 10/971,829, mailed Aug. 14, 2006 (8 pgs).
Office Action for U.S. Appl. No. 10/974,139, mailed Mar. 9, 2006 (10 pgs).
Office Action for U.S. Appl. No. 111/096,313, mailed Aug. 14, 2006 (10 pgs).
Office Action for U.S. Appl. No. 11/096,313, mailed Nov. 29, 2006 (12 pgs).
Office Action for U.S. Appl. No. 11/096,313, mailed Feb. 20, 2007 (4 pgs).
PCT International Search Report dated Nov. 4, 2005, PCT/US2005/022356, filed Jun. 23, 2005.
Article on the web on Answers.com about different ceramic material from Wikipedia <http://www.answers.com/topic/ceramics?cat=technology> (7 pages).
Voisard, Cyril et al., “Electrical Conductivity of Strontium Bismuth Titanate under Controlled Oxygen Partial Pressure,” Journal of the European Ceramic Society, 19, 1999, pp. 1251-1254.
Yoo, Han-III et al., “Defect Structure and Chemical Diffusion in BaTiO3,” Solid State Ionics 135, 2000, pp. 619-623.
Office Action for U.S. Appl. No. 10/974,139, mailed Oct. 9, 2007 (14 pgs).
Office Action for U.S. Appl. No. 10/882,745, mailed Jan. 16, 2008 (12 pages).
Office Action for U.S. Appl. No. 10/096,315, mailed Jan. 25, 2008 (24 pages).
Intel Corporation, “International Preliminary Report on Patentability (IPRP Chapter I) mailed Jan. 18, 2007”, PCT/US2005/022356.
Intel Corporation, “International Preliminary Report on Patentability (IPRP Chapter I) mailed May 3, 2007”, PCT/US2005/037626.
Intel Corporation, “International Preliminary Report on Patentability (IPRP Chapter I) mailed Oct. 11, 2007”, PCT/US2006/012587.
Intel Corporation, “Office Action mailed Jan. 25, 2008”, U.S. Appl. No. 11/096,315, 24 pages.
Intel Corporation, “Office Action mailed Oct. 10, 2007

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Thin film capacitors and methods of making the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thin film capacitors and methods of making the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thin film capacitors and methods of making the same will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4023352

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.