Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent
1996-12-11
1999-03-02
Whitehead, Jr., Carl
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
257666, 257667, 257692, 257693, H01L 2348, H01L 2352
Patent
active
058775480
ABSTRACT:
A semiconductor integrated circuit device includes a semiconductor integrated circuit chip, a IC package enclosing the semiconductor integrated circuit chip, lead terminals, and dummy terminals. The lead terminals are partly embedded in the IC package side by side along its opposed sides, and the dummy terminals are partly embedded in the IC package at both ends of a line of the lead terminals. These terminals are electrically connected with the circuit formed in the chip. One end of each terminal protrudes from either of the opposed sides of the IC package and has a connection to be connected with terminal electrodes of a packaging substrate. The dummy terminals are made wider and/or longer than the lead terminals so as to make their connections larger than those of the lead terminals, thereby enhancing their reliability in point of machine-resistance and heat-resistance.
REFERENCES:
patent: 4928162 (1990-05-01), Lesk et al.
patent: 5057805 (1991-10-01), Kadowki
Ochi Katsunori
Washida Tetsuro
Jr. Carl Whitehead
Mitsubishi Denki & Kabushiki Kaisha
LandOfFree
Terminal configuration in semiconductor IC device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Terminal configuration in semiconductor IC device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Terminal configuration in semiconductor IC device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-425518