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Radially-increasing core power bus grid architecture

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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Recycling a wafer comprising a buffer layer, after having...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Recycling a wafer comprising a buffer layer, after having...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Recyclying faulty multi-die packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Reduced cross-talk noise high density signal interposer with...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Reduced size integrated circuits and methods using test pads loc

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Reduced thickness semiconductor device with IC packages mounted

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Reference plane of integrated circuit packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Reinforced bond pad for a semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Reinforced bond pad for a semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Reliable low thermal resistance package for high power flip clip

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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Rerouted semiconductor device and method of fabrication

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Resin molded type semiconductor device having a conductor film

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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Resin-sealed semiconductor device, manufacturing method...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Resin-sealed type semiconductor device and method for manufactur

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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RF power package with a dual ground

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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RF power transistor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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Routing driven, metal programmable integrated circuit...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Routing for multilayer ceramic substrates to reduce...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Routing method and arrangement for power lines and signal lines

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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