Radially-increasing core power bus grid architecture
Recycling a wafer comprising a buffer layer, after having...
Recycling a wafer comprising a buffer layer, after having...
Recyclying faulty multi-die packages
Reduced cross-talk noise high density signal interposer with...
Reduced size integrated circuits and methods using test pads loc
Reduced thickness semiconductor device with IC packages mounted
Reference plane of integrated circuit packages
Reinforced bond pad for a semiconductor device
Reinforced bond pad for a semiconductor device
Reliable low thermal resistance package for high power flip clip
Rerouted semiconductor device and method of fabrication
Resin molded type semiconductor device having a conductor film
Resin-sealed semiconductor device, manufacturing method...
Resin-sealed type semiconductor device and method for manufactur
RF power package with a dual ground
RF power transistor package
Routing driven, metal programmable integrated circuit...
Routing for multilayer ceramic substrates to reduce...
Routing method and arrangement for power lines and signal lines