4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. With contact or lead
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UFBGA package equipped with interface assembly including a photo

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Ultra thin, leadless and molded surface mount integrated circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Ultra-thin composite package for integrated circuits

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Unique feature design enabling structural integrity for...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Universal substrate for a semiconductor device having...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Utilization of die active surfaces for laterally extending...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Utilization of die repattern layers for die internal connections

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0
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