Thin film flexible interconnect for infrared detectors

Details Thin film flexible interconnect for infrared detectors Thin film flexible interconnect for infrared detectors

1995-06-07

2000-12-12

Chaudhuri, Olik

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257700, 257184, 257459, 438616, H01L 2714, H01L 2945

Patent

active

061603104

ABSTRACT:
An improved interconnect structure for electrically connecting an infrared detector to external circuitry wherein thin film metal conductors are deposited on a thin, insulating tape. One end of the structure terminates at the detector at about 77.degree. Kelvin, the other end terminating at external electronics at about 300.degree. Kelvin. Due to the small cross section of the conductor, heat leak to the detector is minimized. In addition, the carrier film is only 15 microns thick, thus minimizing outgassing material. The use of epoxies is eliminated. The structure can be fabricated in a variety of configurations using standard semiconductor equipment.

REFERENCES:
patent: 4005288 (1977-01-01), Robillard
patent: 4467340 (1984-08-01), Rode et al.
patent: 4920406 (1990-04-01), Watanabe et al.
patent: 5021663 (1991-06-01), Hornbeck
patent: 5291019 (1994-03-01), Powell et al.

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