Thin semiconductor package having stackable lead frame and...

Details Thin semiconductor package having stackable lead frame and... Thin semiconductor package having stackable lead frame and...

2008-03-13

2009-11-10

Smith, Zandra V. (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S686000, C257S787000, C257SE23004, C257SE23043, C257SE23050

Reexamination Certificate

active

07615859

ABSTRACT:
Provided is a thin semiconductor package comprising a semiconductor chip and a lead frame, the lead frame including a paddle portion configured for mounting the semiconductor chip in a manner that exposes bonding pads within an aperture formed in a center portion of the lead frame and a peripheral terminal pad portion for establishing external contacts. A plurality of bonding wires are used to establish electrical connection between a lower surface of the paddle part and corresponding bonding pads with intermediate leads providing connection to the terminal pad portions. The semiconductor chip, lead frame and bonding wires may then be encapsulated to form a thin semiconductor package having a thickness substantially equal to that of the terminal pad portions. The thin semiconductor packages may, in turn, be used to form multi-chip stack packages using known good semiconductor chips to form a high-density compound semiconductor packages.

REFERENCES:
patent: 5428248 (1995-06-01), Cha
patent: 5454905 (1995-10-01), Fogelson
patent: 6337510 (2002-01-01), Chun-Jen et al.
patent: 6878570 (2005-04-01), Lyu et al.
patent: 10-200039 (1998-07-01), None
patent: 10-2001-0064914 (2001-07-01), None
Korean Office Action dated Oct. 31, 2005 for KR Application No. 10-2003-0058508 and translation.

Affiliated with

Also associated with

Rating

Thin semiconductor package having stackable lead frame and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thin semiconductor package having stackable lead frame and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thin semiconductor package having stackable lead frame and... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4141354