Header for electronic components board in surface mount and...
Heat conductivity and brightness enhancing structure for...
Heatsink and package structure for wirebond chip rework and repl
Hermetic package having covers and a base providing for direct e
Hermetic surface mount package for a two terminal semiconductor
Hexagonal array structure for ball grid array packages
High capacitance package substrate
High contact density ball grid array package for flip-chips
High current capacity semiconductor device package and lead...
High current capacity semiconductor device package and lead...
High current lead electrode for semiconductor device
High density chip carrier with integrated passive devices
High density flip chip memory arrays
High density interconnect structure including a chamber
High density semiconductor device having inclined chip mounting
High density signal interposer with power and ground wrap
High density vertically mounted semiconductor package
High density wire bond pattern for integratd circuit package
High density, high speed, semiconductor interconnect using-multi
High frequency microelectronics package