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Hermetic package having covers and a base providing for direct e

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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Hermetic surface mount package for a two terminal semiconductor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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Hexagonal array structure for ball grid array packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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High capacitance package substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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High contact density ball grid array package for flip-chips

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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High current capacity semiconductor device package and lead...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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High current capacity semiconductor device package and lead...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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High current lead electrode for semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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High density chip carrier with integrated passive devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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High density flip chip memory arrays

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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High density interconnect structure including a chamber

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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High density semiconductor device having inclined chip mounting

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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High density signal interposer with power and ground wrap

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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High density vertically mounted semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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High density wire bond pattern for integratd circuit package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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High density, high speed, semiconductor interconnect using-multi

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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High frequency microelectronics package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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High frequency semiconductor device housing package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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High frequency, low cost package for semiconductor devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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High performance and high capacitance package with improved ther

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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