High density chip carrier with integrated passive devices

Details High density chip carrier with integrated passive devices High density chip carrier with integrated passive devices

2006-04-18

2006-04-18

Blum, David S. (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

Reexamination Certificate

active

07030481

ABSTRACT:
A carrier for a semiconductor component is provided having passive components integrated in its substrate. The passive components include decoupling components, such as capacitors and resistors. A set of connections is integrated to provide a close electrical proximity to the supported components.

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Stanley Wolf Silicon Processing for the VLSI Era vol. 2 lattice press 1990 p. 56.

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