Hermetic surface mount package for a two terminal semiconductor

Details Hermetic surface mount package for a two terminal semiconductor Hermetic surface mount package for a two terminal semiconductor

1991-12-23

1996-06-18

Sikes, William L.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

H01L 23148

Patent

active

055280790

ABSTRACT:
A semiconductor package houses a single two terminal semiconductor component. The package is hermetically sealed and is adapted for surface mounting. The package consists of an open ceramic box that has slots for external leads. A glass seal provides the means for sealing the leads to the ceramic box. The semiconductor element is in a die form and one terminal is directly bonded to one of the external leads. The other terminal is bonded to a clip that in turn is bonded to the other lead. A lid is sealed to the top of the ceramic box to provide the hermetic seal.

REFERENCES:
patent: 3820150 (1974-06-01), Nicolaides
patent: 4935803 (1990-06-01), Kalfus et al.
patent: 4945398 (1990-07-01), Kurita et al.

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