High current lead electrode for semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

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Details

C257S686000, C257S673000, C257S734000, C257S735000, C257SE23039, C257SE23042

Reexamination Certificate

active

07728420

ABSTRACT:
A semiconductor package that includes a lead frame riveted to pillars electrically connect to an electrode of a semiconductor die.

REFERENCES:
patent: 5159434 (1992-10-01), Kohno et al.
patent: 6175151 (2001-01-01), Hashimoto
patent: 7122884 (2006-10-01), Cabahug et al.

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