High performance and high capacitance package with improved ther

Details High performance and high capacitance package with improved ther High performance and high capacitance package with improved ther

1994-12-28

1997-03-04

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257723, 257724, H01L 2312

Patent

active

056082614

ABSTRACT:
A thermally dissipative IC package which can accommodate large discrete capacitors. The package substrate incorporates a recessed region on one of its surfaces which is separate from the region in which the IC device is placed. Inside this recessed region is placed a discrete capacitor such that the entire capacitor resides below the surface of the substrate within the recessed region. Finally, a metal plate is attached to the surface of the substrate, unencumbered by the discrete capacitor.

REFERENCES:
patent: 5210683 (1993-05-01), Ley

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