Hexagonal array structure for ball grid array packages

Details Hexagonal array structure for ball grid array packages Hexagonal array structure for ball grid array packages

2007-08-21

2007-08-21

Le, Dung A. (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S778000, C257S784000, C257S786000

Reexamination Certificate

active

10787563

ABSTRACT:
Solder balls may be arranged in hexagonal array on an integrated circuit package. The hexagonal array may increase the solder ball density, reducing solder ball fatigue. In some embodiments, the hexagonal array may be utilized under the die shadow and an orthogonal array may be used outbound thereof.

REFERENCES:
patent: 6057596 (2000-05-01), Lin et al.
patent: 6268568 (2001-07-01), Kim
patent: 6930381 (2005-08-01), Cornelius
patent: 2004/0036176 (2004-02-01), Singh et al.

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