Hermetic package having covers and a base providing for direct e

Details Hermetic package having covers and a base providing for direct e Hermetic package having covers and a base providing for direct e

1991-08-12

1993-04-06

Jackson, Jr., Jerome

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257730, H01L 2302, H01L 2312

Patent

active

052006409

ABSTRACT:
The invention relates to the hermetic packaging of typically one or two dice for high power density applications. The package, which is intended for surface mounting to a heating sinking substrate, is particularly compact. Compactness in surface mount applications is measured as a minimum ratio of package area to die area. In accordance with the invention, compactness is achieved by using a novel vertically developed design in which the electrical connections lie within vertical extensions of the die boundaries giving a package to die ratio of less than 2 to 1.

REFERENCES:
patent: 3908185 (1975-09-01), Martin
patent: 4992628 (1991-02-01), Beppu et al.
patent: 5013871 (1991-05-01), Mahulikar et al.
patent: 5023398 (1991-06-01), Mahulikar et al.
patent: 5103292 (1992-03-01), Mahulikar

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