High capacitance package substrate

Details High capacitance package substrate High capacitance package substrate

2006-05-30

2006-05-30

Whitehead, Jr., Carl (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S709000

Reexamination Certificate

active

07053481

ABSTRACT:
A high capacitance substrate. The substrate includes a core tolerant to sintering thereon of a high k material to provide increased capacitance. The core may be non-ceramic. The material sintered thereon may have a dielectric constant in excess of about 4. The substrate may be a package substrate electrically coupled to a die.

REFERENCES:
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patent: 5576577 (1996-11-01), Takenouchi et al.
patent: 5644327 (1997-07-01), Onyskevych et al.
patent: 5709928 (1998-01-01), Ikeda et al.
patent: 6200400 (2001-03-01), Farooq et al.
patent: 2002/0080556 (2002-06-01), Japp et al.
Young, K.F. and Frederikse, H.P.R., J. Phys. Chem. Ref. Data, 2, 313, (1973), sect. 12, pp. 48.

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