Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent
1995-10-04
1997-06-10
Saadat, Mahshid D.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
257701, 257702, 257774, 257778, 361748, 361749, 361750, H01L 23053, H01L 2312
Patent
active
056379200
ABSTRACT:
A package for mounting a semiconductor device to a circuit board. An insulating substrate is provided, which has at least one layer, and provides rigidity to the package. A plurality of electrically conductive contacts are disposed on the top surface of the substrate, receive the semiconductor device, and make electrical contact between the semiconductor device and the substrate. A plurality of electrically conductive through-holes are formed in the substrate, and extend from the top surface of the substrate to the bottom surface of the substrate. The through-holes make electrical connection between all of the layers of the substrate. Electrical interconnections between the contacts and the through-holes are provided by a plurality of electrically conductive traces. A z-conductive layer is attached to the bottom surface of the substrate. Electrical continuity between the bottom surface of the z-conductive layer and the through-holes extending to the bottom surface of the substrate is substantially limited to the z axis of the z-conductive layer according to a predetermined pitch. A plurality of electrically conductive connectors are attached to the bottom surface of the z-conductive layer, and are disposed so as to be in electrical contact through the z-conductive layer with no more than one through-hole.
REFERENCES:
patent: 3705332 (1972-12-01), Parks
patent: 5065227 (1991-11-01), Frankeny et al.
patent: 5157477 (1992-10-01), Chance
patent: 5381039 (1995-01-01), Morrison
patent: 5434452 (1995-07-01), Higgins, III
Arroyo T. M.
LSI Logic Corporation
Saadat Mahshid D.
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