Dielectric composite material
Differential pair geometry for integrated circuit chip packages
Digital signal processing assembly and test method
Digital signal processor/known good die packaging using...
Direct alignment of contacts
Direct bonded heat spreader
Direct bonding of small parts and module of combined small...
Direct current regulation on integrated circuits under high...
Direct power delivery into an electronic package
Disposable mold runner gate for substrate based electronic...
Donut power mesh scheme for flip chip package
Dual or multiple row package
Dual semiconductor die package with reverse lead form
Dual-sided substrate integrated circuit package including a...
Dummy buried contacts and vias for improving contact via...
Duplexer
Efficient multiple power and ground distribution of SMT IC...
Electric circuit substrate
Electric potential distribution device and an electronic compone
Electric power semiconductor device