Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2000-12-29
2004-03-16
Eckert, George (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S684000, C257S700000, C257S786000, C257S778000
Reexamination Certificate
active
06707145
ABSTRACT:
FIELD OF THE INVENTION
This invention relates to the field of managing power and ground connections between a microchip-substrate and a second substrate and in particular to constructing power and ground planes within solder ball and solder land arrays.
DISCUSSION OF RELATED ART
The ever-increasing density improvements in silicon can be more fully exploited with corresponding wiring density improvements in chip carriers. Challenges to increased wire density have been met with ball grid array packaging designs. However, as the number of balls have increased such as with C4 flip-chip designs, so has the inductance. In addition, the need for a via for each ball has increased the difficulty of routing circuitry around the additional vias. In current ball grid array designs typically one half of the balls are associated with power or ground connections. As linewidths are reduced, inductance and routing problems will continue to become more severe.
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Olivier Robert L.
Pollock Steven L.
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