Electric potential distribution device and an electronic compone

Details Electric potential distribution device and an electronic compone Electric potential distribution device and an electronic compone

1991-08-26

1993-08-17

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257704, 257723, 257724, 257691, H01L 2312, H01L 2314, H01L 2302

Patent

active

052372049

ABSTRACT:
The invention provides a device for distributing electric potentials for supplying a component with electric power, capable of being incorporated in the case in which the component is encapsulated.
This device is in the form of a plate comprising conducting planes connected to external power supply potentials. This plate either forms the cover of the case or is placed inside the case above said component. Each of the conducting planes of the device is connected, outside the case, to the power supply potential and, inside the case, at multiple points to the component so as to distribute these potentials to the appropriate inputs/outputs thereof, thus reducing the number of inputs/outputs of the case.

REFERENCES:
patent: 4249196 (1981-02-01), Durney et al.
patent: 4338621 (1982-07-01), Braun
patent: 4539622 (1985-09-01), Akasaki
patent: 4541003 (1985-09-01), Otsuka et al.
patent: 4608592 (1986-08-01), Miyamoto
patent: 4654694 (1987-03-01), Val
patent: 4903120 (1990-02-01), Beene et al.
"Improved Electrical Performance Required for Future MOS Packaging"--Schaper et al.,--IEEE Trans. on Components.
Hybrids and Manufacturing Technology, vol. (HMT-6 (1983), Sep., No. 3, NY USA) pp. 283-289.
"Dual-in-Line Package Socket Piggy back Structure", McAtee--IBM Technical Disclosure, vol. 16, No. 4, Sep. 1973, p. 1315.

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