Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2008-02-11
2011-11-29
Clark, Jasmine (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S048000, C257S734000, C257S786000, C257SE23010, C257SE23178, C257SE21499
Reexamination Certificate
active
08067830
ABSTRACT:
A dual or multiple row package (300) is provided which comprises a first plurality of terminals (303, 304, 305) and a second plurality of terminals (306, 307), which first and second plurality of terminals are exposed outside the encapsulation at a first side of the package. The terminals of the first plurality of terminals (303, 304, 305) are arranged in a first row (301), wherein a distance between each pair of adjacent terminals in the first row (301) is greater or equal than a first threshold value. Furthermore, the terminals of the second plurality of terminals (306, 307) are arranged in a second row (302), wherein a distance between each pair of adjacent terminals in the second row (302) is greater or equal than a second threshold and a distance between the first row (301) and the second row (302) is smaller than at least the first threshold value.
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Dirks Peter
Groeneveld Dirk
Clark Jasmine
NXP B.V.
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