Dual or multiple row package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

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Details

C257S048000, C257S734000, C257S786000, C257SE23010, C257SE23178, C257SE21499

Reexamination Certificate

active

08067830

ABSTRACT:
A dual or multiple row package (300) is provided which comprises a first plurality of terminals (303, 304, 305) and a second plurality of terminals (306, 307), which first and second plurality of terminals are exposed outside the encapsulation at a first side of the package. The terminals of the first plurality of terminals (303, 304, 305) are arranged in a first row (301), wherein a distance between each pair of adjacent terminals in the first row (301) is greater or equal than a first threshold value. Furthermore, the terminals of the second plurality of terminals (306, 307) are arranged in a second row (302), wherein a distance between each pair of adjacent terminals in the second row (302) is greater or equal than a second threshold and a distance between the first row (301) and the second row (302) is smaller than at least the first threshold value.

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patent: 6683368 (2004-01-01), Mostafazadeh
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patent: 2004057668 (2004-08-01), None

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