Electric circuit substrate

Details Electric circuit substrate Electric circuit substrate

2006-03-28

2006-03-28

Le, Dung (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S737000, C257S719000, C349S149000, C349S150000

Reexamination Certificate

active

07019393

ABSTRACT:
On a glass substrate of a liquid crystal display device, electrode parts to which metallic electrodes (bumps) of an IC circuit are connected from an upper part are formed. The electrode parts are formed by opening an interlayer dielectric film at parts corresponding to metal wiring and forming land shaped electrode pads in the opening parts. In this invention, the planar forms of the electrode pads are smaller than the opening parts of the interlayer dielectric film. Thus, the planarization of the peripheral surfaces around the electrode parts is improved. Accordingly, integrated circuit devices (IC) or semiconductor chips can be connected with high reliability.

REFERENCES:
patent: 4818728 (1989-04-01), Rai et al.
patent: 5371037 (1994-12-01), Yonehara
patent: 6245594 (2001-06-01), Wu et al.
patent: 2003/0168734 (2003-09-01), Fang
patent: 2004/0032024 (2004-02-01), Lee et al.
patent: 2004/0099949 (2004-05-01), Cho
patent: 2005/0218476 (2005-10-01), Lee et al.

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