Dual-sided substrate integrated circuit package including a...

Details Dual-sided substrate integrated circuit package including a... Dual-sided substrate integrated circuit package including a...

2006-12-12

2006-12-12

Williams, Alexander Oscar (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257SE23063, C257S673000, C257S676000, C257S734000, C257S775000, C257S776000, C257S691000, C257SE23066, C257S666000, C257S698000

Reexamination Certificate

active

07148564

ABSTRACT:
An integrated circuit package includes a first non-conductive substrate having a first inner surface and a second non-conductive substrate having a second inner surface. A die having a first thickness is disposed between the first and second inner surfaces. A leadframe includes a member having a proximal end and a distal end. The proximal end has a second thickness less than the first thickness. The distal end is disposed between the first and second inner surfaces. The distal end is undulated such that the distal end has an effective thickness greater than the second thickness.

REFERENCES:
patent: 5166098 (1992-11-01), Micic et al.
patent: 5767570 (1998-06-01), Rostoker
patent: 6084291 (2000-07-01), Fujimori
patent: 6232148 (2001-05-01), Ma et al.
patent: 6307755 (2001-10-01), Williams et al.
patent: 6459148 (2002-10-01), Chun-Jen et al.
patent: 5-47980 (1993-02-01), None
patent: 6-252334 (1994-09-01), None
patent: 2001-298142 (2001-10-01), None

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