Direct power delivery into an electronic package

Details Direct power delivery into an electronic package Direct power delivery into an electronic package

2006-03-22

2009-12-08

Dang, Trung (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

Reexamination Certificate

active

07629680

ABSTRACT:
In some embodiments, direct power delivery into an electronic package is presented. In this regard, a substrate is introduced having a conductive substrate core designed to physically connect with a power cable. Other embodiments are also disclosed and claimed.

REFERENCES:
patent: 5612254 (1997-03-01), Mu et al.
patent: 6313493 (2001-11-01), Mori et al.
patent: 2005/0133901 (2005-06-01), Edwards et al.
patent: 2005/0146017 (2005-07-01), Koide
patent: 2005/0276029 (2005-12-01), Lober

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