Duplexer

Details Duplexer Duplexer

2006-04-25

2006-04-25

Potter, Roy (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S691000

Reexamination Certificate

active

07034392

ABSTRACT:
A filter chip lying on an upper surface of a top layer package substrate is connected to an upper surface ground electrode (235). The upper ground electrode (235) and a lower surface ground electrode (237) are connected to each other via through electrodes (261, 262, 263), ground wiring patterns (251, 252), first connecting lines (271to276), and second connecting lines (281, 282). The first connecting lines (271to276) are connected to the ground wiring patterns (251, 252), whereas the second connecting lines (281, 282) are not connected to the ground wiring patterns (251, 252), respectively. Owing to the provision of the connecting lines connected to the ground wiring patterns (251, 252) and the connecting lines unconnected to the ground wiring patterns (251, 252), the impedance between a multilayer package substrate and ground can be adjusted.

REFERENCES:
patent: 5859473 (1999-01-01), Ikata et al.
patent: 10-126213 (1998-05-01), None
patent: 2002-124847 (2002-04-01), None

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