Reduction of Cu line damage by two-step CMP
Reduction of damage to thermal interface material due to...
Reduction of dislocations in a heteroepitaxial semiconductor str
Reduction of dopant diffusion by the co-implantation of impuriti
Reduction of dopant loss in a gate structure
Reduction of etch-rate drift in HDP processes
Reduction of feature critical dimensions
Reduction of feature critical dimensions
Reduction of feature critical dimensions using multiple masks
Reduction of field edge thinning in peripheral devices
Reduction of field edge thinning in peripheral devices
Reduction of field oxide step height during semiconductor fabric
Reduction of gate-induced drain leakage in semiconductor devices
Reduction of imprint in ferroelectric devices using a...
Reduction of induced charge in SOI devices during focused...
Reduction of lateral silicide growth in integrated circuit...
Reduction of masking and doping steps in a method of fabricating
Reduction of mechanical stress in shallow trench isolation...
Reduction of memory instability by local adaptation of...
Reduction of metal silicide/silicon interface roughness by...