Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Reexamination Certificate
2006-08-07
2009-06-09
Toledo, Fernando L (Department: 2895)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Insulative housing or support
C257SE23087, C257SE23090, C257SE23092, C257SE25013
Reexamination Certificate
active
07544542
ABSTRACT:
Various method and apparatus for packaging an integrated circuit are provided. In one aspect, a method of packaging an integrated circuit is provided that includes coupling an integrated circuit to a substrate, mixing an adhesive with a plurality of particles, and coupling a lid to the substrate with the adhesive. At least a portion of the plurality of particles in the adhesive oppose compressive force from the lid to restrict rotation of the lid relative to the substrate.
REFERENCES:
patent: 5329160 (1994-07-01), Miura et al.
patent: 5552635 (1996-09-01), Kim et al.
patent: 5844309 (1998-12-01), Takigawa et al.
patent: 6114413 (2000-09-01), Kang et al.
patent: 6409859 (2002-06-01), Chung
patent: 6496373 (2002-12-01), Chung
patent: 6581276 (2003-06-01), Chung
patent: 6617698 (2003-09-01), Buchwalter et al.
patent: 6652665 (2003-11-01), Sachdev et al.
patent: 6748350 (2004-06-01), Rumer et al.
patent: 6848172 (2005-02-01), Fitzgerald et al.
patent: 6848610 (2005-02-01), Liu
patent: 6867978 (2005-03-01), Whittenburg et al.
patent: 6870258 (2005-03-01), Too
patent: 6882535 (2005-04-01), Labanok et al.
patent: 6924170 (2005-08-01), Ravi et al.
patent: 6934154 (2005-08-01), Prasher et al.
patent: 6936501 (2005-08-01), Too et al.
patent: 6987317 (2006-01-01), Pike
patent: 6989586 (2006-01-01), Agraharam et al.
patent: 7009289 (2006-03-01), Hu et al.
patent: 7012011 (2006-03-01), Chrysler et al.
patent: 7014093 (2006-03-01), Houle et al.
patent: 7015073 (2006-03-01), Houle et al.
patent: 7078803 (2006-07-01), Tilton et al.
patent: 2001/0029119 (2001-10-01), Chung
patent: 2002/0000239 (2002-01-01), Sachdev et al.
patent: 2002/0179921 (2002-12-01), Cohn
patent: 2004/0061218 (2004-04-01), Tilton et al.
patent: 2004/0077126 (2004-04-01), Geefay
patent: 2007/0108634 (2007-05-01), Higashi et al.
patent: 2007/0251639 (2007-11-01), Jayaraman et al.
patent: 2007/0270536 (2007-11-01), Sachdev et al.
patent: 2345577 (2000-07-01), None
patent: WO 2005055317 (2005-06-01), None
International Search Report for PCT/US2007/017523; Dec. 13, 2007.
Diep Jacquana
Khan Mohammad
Master Raj N.
Too Seah Sun
Advanced Micro Devices , Inc.
Honeycutt Timothy M.
Toledo Fernando L
LandOfFree
Reduction of damage to thermal interface material due to... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Reduction of damage to thermal interface material due to..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Reduction of damage to thermal interface material due to... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4071519