Under bump metallization pad and solder bump connections

Details Under bump metallization pad and solder bump connections Under bump metallization pad and solder bump connections

2007-04-17

2007-04-17

Lee, Hsien-Ming (Department: 2823)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S613000, C438S614000, C438S615000

Reexamination Certificate

active

10288419

ABSTRACT:
The present invention relates to an improved method of forming and structure for under bump metallurgy (“UBM”) pads for a flip chip which reduces the number of metal layers and requires the use of only a single passivation layer to form, thus eliminating a masking step required in typical prior art processes. The method also includes repatterning bond pad locations.

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