Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2005-08-23
2005-08-23
Lee, Eddie (Department: 2811)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
Reexamination Certificate
active
06933223
ABSTRACT:
A wire bonding technique for manufacturing semiconductor devices that results in a bonded wire having a small loop height. The wire bonding technique involves a capillary tool that ball bonds a wire to a first contact point, then moves upwards, and then towards a second contact point to which the wire will be attached. The capillary tool only moves towards the second contact point in the lateral direction. The height of the wire loop of the bonded wires can be controlled to have desired wire loop heights. The bonding technique can be used in semiconductor devices with stacked dice and in devices where a die and a contact lead are approximately at the same height.
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Soon Lim Peng
Yeen Chan Peng
Beyer Weaver & Thomas LLP
Lee Eddie
National Semiconductor Corporation
Owens Douglas W.
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