Under-bump metallization layers and electroplated solder...

Details Under-bump metallization layers and electroplated solder... Under-bump metallization layers and electroplated solder...

2007-04-03

2007-04-03

Ha, Nathan W. (Department: 2814)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

Reexamination Certificate

active

10854174

ABSTRACT:
A series of improved processes and methods to manufacture solder bumps on the wafer which shrink the space among solder bumps and reduce the cost of manufacturing. A design method and a relevant manufacturing process are introduced to form an organic material or metal material layer, which is called a Bump-Reflow-Control Layer. The pad patterns can be defined by this method. A mechanical part is designed with a hermetic cover to improve the photoresist process. The series of photolithography process including the designing method of related photolithography mask is introduced to achieve the high quality and thick photoresist.

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