Wafer level hermetically sealed MEMS device

Details Wafer level hermetically sealed MEMS device Wafer level hermetically sealed MEMS device

2005-02-25

2010-10-19

Fulk, Steven J (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Physical deformation

C257S689000, C257SE23193, C438S051000, C438S456000

Reexamination Certificate

active

07816745

ABSTRACT:
A hermetically sealed microelectromechanical system (MEMS) package includes a MEMS switch having a movable portion and a stationary portion with an electrical contact thereon. A glass lid is anodically bonded to the MEMS switch to form a sealed cavity over the movable portion of the MEMS switch. The glass lid includes a contact aperture to allow access to the electrical contact on the stationary portion of the MEMS switch. A family of body-implantable hermetically-sealed MEMS packages are provided according to certain aspects and embodiments of the present invention.

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